India fab and OSAT programme, Dholera and Assam.
Fabs, foundries and OSAT, equipment and metrology, materials and gases, chip companies, EDA and electronics manufacturing. Every link is official. No signup, no email.
India fab and OSAT programme, Dholera and Assam.
World largest foundry, supplier management portal.
Memory and foundry, large equipment and materials spend.
Specialty foundry for automotive and RF.
Taiwan foundry, mature and specialty nodes.
Memory manufacturer, DRAM and NAND fabs.
Memory fabs and the Sanand assembly plant in India.
Power and automotive semiconductors, own fabs.
Automotive and industrial silicon, SiC capacity.
Automotive MEMS and power devices, Dresden fab.
India OSAT venture, Sanand assembly and test.
India OSAT and electronics manufacturing.
India semiconductor assembly and packaging, Surat.
Long-standing Indian discrete device manufacturer.
Largest OSAT globally, assembly and test services.
Advanced packaging and test, automotive qualified.
Foundry services and large equipment programme.
300mm analog fab expansion.
Power and image sensors, SiC capacity.
Silicon carbide materials and devices.
Specialty foundry for display and power.
Foundry partner for India fab projects.
China specialty foundry.
Largest mainland China foundry.
Analog and mixed-signal foundry for automotive.
Analog specialty foundry.
Major OSAT for packaging and test.
Memory packaging and test services.
Assembly and test, part of ASE Group.
India opto-semiconductor packaging.
India semiconductor and OSAT venture.
India memory packaging and electronics.
India display and semiconductor fab ambitions.
TSMC supplier portal with registration and temporary accounts.
Display driver IC foundry.
Analog and power foundry, Guangzhou.
Advanced packaging and test.
Packaging and test services.
Display driver and memory packaging and test.
IC testing services.
Driver IC bumping and COF packaging.
Official ASML supplier portal for lithography supply chain.
Largest wafer fab equipment maker, buys materials, subsystems and services.
Etch and deposition equipment, deep subsystem supply chain.
Inspection and metrology, buys optics, sensors and precision motion.
Coater developers, etch and deposition systems.
Automated test equipment for logic and memory.
Semiconductor test systems and robotics group.
ALD and epitaxy systems for advanced nodes.
Back-end assembly and advanced packaging equipment.
Wafer cleaning and surface preparation systems.
Process control, inspection and lithography metrology.
Thin film deposition, laser annealing and MOCVD.
Wafer bonding and nanoimprint lithography.
Dicing, grinding and polishing for back-end.
Electronic design and test instrumentation.
Optics for lithography and process control.
Analytical and metrology instruments for semiconductors.
Mass flow control and analysis for fabs.
Lithography systems and metrology.
Steppers and nanoimprint lithography.
Batch thermal processing and ALD.
Etch systems and electron microscopy for fabs.
Korean track, cleaning and packaging equipment.
Korean deposition and thermal equipment.
Optical and X-ray metrology for process control.
Inspection and metrology for advanced packaging.
Lithography and inspection product lines.
Wafer handling robotics and vacuum automation.
AMHS and OHT systems for fabs.
Vacuum, power and photonics subsystems for fabs.
Precision power and process control for semiconductors.
Vacuum pumps and abatement for fabs.
CMP systems and dry vacuum pumps.
Probers, dicers and metrology.
Test handlers, contactors and inspection.
Probe cards and test systems.
Wire bonders and advanced packaging tools.
Die attach and hybrid bonding for packaging.
Bonding, coating and photomask equipment.
MOCVD for compound semiconductors and LEDs.
Largest Chinese wafer fab equipment maker.
Etch and CVD systems, Advanced Micro-Fabrication Equipment.
Cleaning, plating and PECVD tools.
Coater and developer track systems.
Thin film deposition equipment.
CMP polishing systems.
Shanghai Micro Electronics, lithography and inspection.
Fab systems integration and materials.
Equipment modules and subsystems.
EUV pods and reticle carriers.
Equipment manufacturing and distribution.
Specialty chemicals and materials for chipmaking.
Photoresists, CMP slurries and cleaning chemistry.
Packaging materials and SiC substrates.
Largest silicon wafer supplier and photoresists.
Silicon wafers for advanced and mature nodes.
Ultra high purity gases and fab gas systems.
Electronic specialty gases and precursors.
India industrial and electronic gases.
Fluoropolymers and specialty chemicals for electronics.
Filtration, materials handling and advanced materials.
Photoresists and semiconductor materials.
Photoresists and process chemicals.
CMP pads, photoresists and packaging materials.
Tapes and films for wafer processing.
Silicon wafer manufacturer.
European silicon wafer supplier.
Silicon and SiC wafers.
Electronic gases and supply systems.
Specialty gases and delivery for fabs.
Fluorine chemistry and specialty materials.
CMP slurries and pads, now part of Entegris.
Ultrapure water systems for fabs.
CMP slurries and cleaning chemistry.
Ultra high purity sputtering targets.
Semiconductor materials and equipment distribution.
Silicon and solar wafers, GlobalWafers parent.
Silicon and epitaxial wafers.
Largest display panel maker, LCD and OLED.
Display panels including automotive.
Display panels and automotive displays.
Automotive processors, radar and secure connectivity.
Automotive MCUs and SoCs.
Analog and embedded processing.
Automotive cockpit and ADAS compute.
AV compute, robotics platforms and GPUs.
Adaptive computing and embedded silicon.
Automotive ethernet and data infrastructure silicon.
EDA tools and semiconductor IP.
EDA, IP and system design tools.
Mentor toolchain, verification and PCB design.
Processor IP for automotive, mobile and edge.
India semiconductor design services and ASICs.
India fabless, edge AI SoCs.
India RISC-V core IP from IIT Madras lineage.
Automotive microcontrollers and power devices.
Precision analog, BMS and radar front ends.
MCUs, FPGAs and automotive networking.
Edge AI vision SoCs for automotive and robotics.
EyeQ ADAS silicon and full stack.
China automotive AI compute platforms.
China autonomous driving SoCs.
RISC-V processor IP.
GPU and AI accelerator IP.
Memory interface and security IP.
High speed connectivity IP and chiplets.
India semiconductor engineering and test services.
India embedded and semiconductor R&D services.
Mixed signal design services, now HCLTech.
India telecom and 5G semiconductor design.
India RISC-V SoC startup from IIT Madras.
India analog and RF IP.
India government R&D, VEGA processors.
Smartphone, connectivity and automotive SoCs.
Display driver ICs and SoCs.
Networking, audio and PC interface ICs.
ASIC design services, TSMC affiliate.
HPC and AI ASIC design services.
RISC-V embedded processor IP.
Embedded non volatile memory IP.
Silicon foundation IP.
NAND flash controllers.
NAND controllers and SSD solutions.
Microcontrollers and IoT ICs.
Display drivers and wafer level optics.
USB and PCIe interface controllers.
Application processors and edge AI SoCs.
Application SoCs for IoT and automotive.
Media and set top box SoCs.
Smartphone and IoT SoCs.
Analog integrated circuits.
Power management ICs.
CMOS image sensors for automotive and mobile.
NOR flash and microcontrollers.
Memory interface and DDR ICs.
Silicon platform as a service and IP.
AI training and inference accelerators.
General purpose GPUs.
DRAM manufacturer.
Specialty DRAM and flash memory.
NOR and NAND flash memory.
DRIVE platform. the Inception program is a free, fast door for startups.
Snapdragon Digital Chassis: cockpit, ADAS, connectivity.
EyeQ ADAS silicon and full-stack AV. Intel family.
Radar, networking, S32 vehicle compute.
Power semiconductors number one in automotive. MCUs, sensors.
MCUs and SoCs (R-Car) across body, ADAS, EV.
Analog, radar (AWR), power for every ECU.
SiC power leader, MCUs, sensors.
Image sensors and SiC power.
AI vision SoCs (CV3) for ADAS and L4.
China's leading ADAS compute (Journey series). many OEM wins.
Huashan and Wudang auto compute platforms.
Edge AI accelerators for camera-heavy systems.
Software-centric edge ML SoC. automotive push.
Exynos Auto, image sensors, memory.
Automotive image sensor leader.
Automotive camera sensors across cabin and ADAS.
Worlds largest electronics manufacturing services group.
Electronics manufacturing services.
Notebook and AI server manufacturing.
Notebooks and electronics manufacturing.
Servers and electronics manufacturing.
Servers and electronics manufacturing.
Connectors and precision manufacturing.
Electronics manufacturing and components.
Largest PCB and flexible PCB maker.
IC substrates and printed circuit boards.
PCB and IC substrates.
Printed circuit boards.
IC substrates and interconnect.
Industrial and edge computing boards for robotics and automation.
Edge computing and machine vision platforms for industrial robots.
Industrial IoT, embedded computing and automation hardware.
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